Effect of the temperature on the strain distribution induced in SOI photonic substrate by copper filled TSVs, using advanced scanning X-ray nano- diffraction - Aix-Marseille Université
Conference Papers Year : 2016

Effect of the temperature on the strain distribution induced in SOI photonic substrate by copper filled TSVs, using advanced scanning X-ray nano- diffraction

No file

Dates and versions

hal-01454838 , version 1 (03-02-2017)

Identifiers

  • HAL Id : hal-01454838 , version 1

Cite

B. Vianne, S. Escoubas, M.I. Richard, V. Fiori, A. Farcy, et al.. Effect of the temperature on the strain distribution induced in SOI photonic substrate by copper filled TSVs, using advanced scanning X-ray nano- diffraction. 14th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics–Experiment and Simulation, May 2016, Dresden, Germany. ⟨hal-01454838⟩
184 View
0 Download

Share

More