Effect of the temperature on the strain distribution induced in SOI photonic substrate by copper filled TSVs, using advanced scanning X-ray nano- diffraction - Aix-Marseille Université
Communication Dans Un Congrès Année : 2016

Effect of the temperature on the strain distribution induced in SOI photonic substrate by copper filled TSVs, using advanced scanning X-ray nano- diffraction

Domaines

Micro et nanotechnologies/Microélectronique

IM2NP Bibliométrie  : Connectez-vous pour contacter le contributeur

https://amu.hal.science/hal-01454838

Soumis le : vendredi 3 février 2017-09:43:35

Dernière modification le : lundi 10 juin 2024-16:58:03

Fichier non déposé

Dates et versions

hal-01454838 , version 1 (03-02-2017)

Identifiants

  • HAL Id : hal-01454838 , version 1

Citer

B. Vianne, S. Escoubas, M.I. Richard, V. Fiori, A. Farcy, et al.. Effect of the temperature on the strain distribution induced in SOI photonic substrate by copper filled TSVs, using advanced scanning X-ray nano- diffraction. 14th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics–Experiment and Simulation, May 2016, Dresden, Germany. ⟨hal-01454838⟩

Exporter

BibTeX XML-TEI Dublin Core DC Terms EndNote DataCite

Collections

UNIV-TLN CNRS UNIV-AMU IM2NP
185 Consultations
0 Téléchargements

Partager

More