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authFullName_s : Emeline Souchier
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In-situ characterization of thermomechanical behavior of copper nano-interconnect for 3D integration

Bassel Ayoub , Stéphane Moreau , Sandrine Lhostis , Hélène Frémont , Sébastien Mermoz , et al.
Microelectronic Engineering, 2022, 261, pp.111809. ⟨10.1016/j.mee.2022.111809⟩
Journal articles hal-03672631v1