Effect of the temperature on the strain distribution induced in SOI photonic substrate by copper filled TSVs, using advanced scanning X-ray nano- diffraction - Aix-Marseille Université Access content directly
Conference Papers Year : 2016

Effect of the temperature on the strain distribution induced in SOI photonic substrate by copper filled TSVs, using advanced scanning X-ray nano- diffraction

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Micro and nanotechnologies/Microelectronics

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https://amu.hal.science/hal-01454838

Submitted on : Friday, February 3, 2017-9:43:35 AM

Last modification on : Monday, June 10, 2024-4:58:03 PM

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hal-01454838 , version 1 (03-02-2017)

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  • HAL Id : hal-01454838 , version 1

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B. Vianne, S. Escoubas, M.I. Richard, V. Fiori, A. Farcy, et al.. Effect of the temperature on the strain distribution induced in SOI photonic substrate by copper filled TSVs, using advanced scanning X-ray nano- diffraction. 14th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics–Experiment and Simulation, May 2016, Dresden, Germany. ⟨hal-01454838⟩

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