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Conference Papers Year : 2018

Resilient Automotive Products through Process, Temperature and Aging Compensation Schemes

S. Mhira
  • Function : Author
V. Huard
  • Function : Author
D. Arora
  • Function : Author
P. Flatresse
  • Function : Author
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Dates and versions

hal-02111108 , version 1 (25-04-2019)

Identifiers

  • HAL Id : hal-02111108 , version 1

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S. Mhira, V. Huard, D. Arora, P. Flatresse, A. Bravaix. Resilient Automotive Products through Process, Temperature and Aging Compensation Schemes. IEEE International Reliability Physics Symposium, (IRPS), Mar 2018, Burlingame, California, United States. pp.3D.1-1, 3D.1-7. ⟨hal-02111108⟩
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