Conference Papers
Year : 2018
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https://amu.hal.science/hal-02111108
Submitted on : Thursday, April 25, 2019-5:50:52 PM
Last modification on : Tuesday, December 5, 2023-6:08:07 PM
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- HAL Id : hal-02111108 , version 1
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S. Mhira, V. Huard, D. Arora, P. Flatresse, A. Bravaix. Resilient Automotive Products through Process, Temperature and Aging Compensation Schemes. IEEE International Reliability Physics Symposium, (IRPS), Mar 2018, Burlingame, California, United States. pp.3D.1-1, 3D.1-7. ⟨hal-02111108⟩
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