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Proceedings/Recueil Des Communications Année : 2023

40nm SONOS Embedded Select in Trench Memory

Résumé

In this paper, we discuss a new development of 40nm SONOS eSTM™ (embedded Select in Trench Memory). We present an experimental study based on hot carrier injection mechanism for both programming/erase operations, performed on this new eNVM architecture. The optimization of drain and select gate biases, in order to define the programming and erasing threshold voltages, is also detailed. All the characterizations have been carried out for two different SONOS eSTM™ architectures giving an opportunity to propose different solutions. One of this using a continuous silicon nitride layer for two neighbour cells, taking advantage on the discrete charge trapping nature. As well, we performed endurance tests up to one million cycles for both architectures to evaluate the memory endurance.
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Dates et versions

hal-04527190 , version 1 (29-03-2024)

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Radouane Habhab, Vincenzo Della Marca, Pascal Masson, Nadia Miridi, Clement Pribat, et al.. 40nm SONOS Embedded Select in Trench Memory. ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference (ESSDERC), IEEE, pp.21-24, 2023, ⟨10.1109/ESSDERC59256.2023.10268472⟩. ⟨hal-04527190⟩
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